RF Process Engineer: Die Attach & Wire Bonding

Filtronic PLC is expanding its Process Engineering team at NetPark to scale advanced packaging and assembly of RF modules. The Process Engineer will evaluate, develop, optimise and control die attach and wire bonding processes, ensuring manufacturability and high yield for future products.You will collaborate with RF, mechanical and operations teams, define tooling and automation needs, run feasibility trials, and drive continuous improvement through SPC, DMAIC and robust validation. #J-18808-Ljbffr