Senior 3D/2.5D Heterogeneous Packaging Engineer

GLOBALFOUNDRIES U.S. 2 LLC · Essex junction, United States

GlobalFoundries is seeking a senior engineer for chiplet-based 2.5D/3D integration across silicon, glass and mold interposers, including embedded silicon bridges. You will own end-to-end integration and work with fabrication, design, and reliability teams.

The role emphasizes leadership, innovation, and collaboration with external partners to advance heterogeneous integration capabilities for multiple programs. Requires 10+ years of related experience and an MS degree.