Applications Engineer HSDC

Texas Instruments · United States

The Analog Signal Chain (ASC) team designs and develops more than 30,000 products for the industrial, automotive, personal electronics and communications markets that condition, amplify and convert signals into digital data to be processed by other semiconductors. When you like a photo on social media, youre using ASCs signal conditioning technology. When youre at the grocery store, ASCs sensors ensure your produce is delivered at the optimum temperature. Made up of six dynamic business units and 20+ product lines across 11 sites, ASC is at the forefront of industry trends. Join ASC for the opportunity to create innovative and compelling products for customers that then help create a better world.

HSC is a deeply technically fulfilling product line, giving opportunities to grow and develop on the worlds highest performance RF sampling converters, with direct sampling converter products ranging from 100 Msps (mega samples per second) to over 64 Gsps (giga samples per second). HSC enables unique opportunities for technical growth and development where deep core expertise in hardware, software, RF, FPGA firmware, digital signal processing, and power integrity each play a crucial role to develop a world class system. Key markets of Aerospace & Defense, Test & Measurement, and Datacenter each demand highly differentiated and optimized solutions. HSC is a highly invested and growing business, looking to expand to support more customers with deeper technical engagement to continue to win.

Were searching for applications engineers who have the passion and excitement to grow, innovate, take an active role in product definition, work with cross-functional teams across the world, execute the characterization until ramp, and provide post ramp application support to customers.

This role is for the position of an Applications Engineer with the High Speed Data Converters (HSC) Product line in the Data Converters and Clocks (DCC) Business Unit under ASC. This role in applications engineering is focused on understanding the end equipment at the system level to define and design reference designs for key core businesses within HSC. Key responsibilities include:

• Work with systems and marketing engineers to provide support to early design in activities for new products.
• Create and design reference design boards and evaluation modules based on end equipment such software defined radio, phased-array radar, wideband signal synthesis and detection, and RF instrumentation to support correlation and evaluation activities of new products and new customer implementation ideas.
  • Understand the market need for the end equipment and be able to define the reference design to grow the market.
  • Understand the industry standard and join the standard body committee to ensure the reference design and TIs products can meet and exceed the standards.
  • Work with various team members to complete the PCB schematic, layout, FPGA firmware, and embedded software to complete the reference designs.
  • Create user guides, test procedures, and proper release of EVM boards for customer consumption.
• Answer customer questions and support design-in activities for released products.
  • Forum and email questions from customers.
  • Schematic and Layout Review of customer application.
  • Debug of customer problems by re-creating issues in our evaluation boards and/or customer boards.
  • On-site support for customer board as required.
• Drive new silicon testing from an application perspective to ensure robustness of the product and system integration.
  • Write application notes that explain different use cases, implementation and/or flexibility of our products.
  • Verify key features inside high-speed data converters and develop the verification result into applications note for customers.
  • Test and characterize customer specific use case scenarios to ensure robustness and quality of the data converter systems.

Minimum qualifications

• BS in Electrical Engineering or relevant field of study
• 2 + years of relevant experiences Analog /RF systems, SW Automation, Mixed-signal PCB or Systems integration

Preferred qualifications

• Demonstrated strong analytical and problem solving skills.
• Strong verbal and written communication skills.
• Ability to work in teams and collaborate effectively with people in different functions.
• Strong time management skills that enable on-time project delivery.
• Demonstrated ability to build strong, influential relationships.
• Ability to work effectively in a fast-paced and rapidly changing environment.
• Ability to take the initiative and drive for results.
• Strong drive to enable cutting edge system integration in Aerospace & Defense and Test & Measurement markets.
• Good understanding of RF and microwave components, systems, and measurements.
  • Knowledge of measurements techniques and experience in interpreting the measurement results.
  • RF board issues debugging skills (capability to identify possible sources of RF performance degradation)
  • Experience in high-speed signal processing, such as digital up/down conversion, digital filtering and equalization, frequency planning, beamforming
• Laboratory automation skills
  • Preferred: good understanding of Python automation.
• High speed mixed signal PCB debug skills
  • Ability to express basic understanding of digital data bus, data signal integrity, diagnostic of bit errors, and various hand-shaking protocol errors
  • Experience in RF network matching & optimization, high-speed PCB design, RF modeling expertise using Ansys toolkit (ie. HFSS, SiWave)
  • Preferred: experiences in PCI-E, JESD204, Ethernet, HDMI/Display Port.
• Describe and demonstrate skill set in either board level integration or device-to-device level integration. Examples of board level or device-to-device level integration include building prototypes with available off the shelf FPGA EVMs and interfacing with various analog front end capture cards.