IC Package Mechanical FEA Engineer

Our client is a leader in Data Center Networking and AI markets. They have a group focused on high-speed ASIC technology for these markets. They're currently looking for an IC Package Mechanical FEA Engineer who will focus on the design for mechanical design aspects of ASIC packages. The ideal candidate will have an advanced degree and 5 years of experience handling FEA, stress analysis, and will have graduate level courses in advanced strength of materials, elasticity, plasticity, continuum mechanics, and finite elements (theoretical basis). Additionally, they want someone proficient in ANSYS Mechanical with APDL to generate models, as well as someone who uses Abaqus with Python scripting to generate models.