Mechanical Hardware Engineer II - Thermal & Enclosures

Hewlett Packard Enterprise Company · Spring, United States

Hewlett Packard Enterprise is seeking a Hardware Mechanical Engineer II for a hybrid role, averaging two days per week in an HPE office. You will design mechanical and thermal hardware, develop validation plans, and collaborate with partners to deliver cost-effective, reliable solutions.

The role requires a Bachelor’s or Master’s in Mechanical Engineering (or equivalent) and typically 2–4 years of experience, with strong Creo and analytical skills.