Process Integration Development Manager - Advanced Packaging
RediRecruit RPO Solutions · United, Pennsylvania, United States
FULL TIMEpermanent
Job Description
Location:Remote – United States Compensation: $190,000–$250,000 base salary + Equity & Bonus
The full job description covers all associated skills, previous experience, and any qualifications that applicants are expected to have.
We are hiring Director, Process Integration & Development, an innovative technology company working at the forefront of advanced semiconductor packaging and heterogeneous integration.
This is an exciting opportunity for a senior semiconductor professional to join a founding technical team, lead critical process development initiatives, and contribute to next-generation technologies supporting AI and high-performance computing.
About the Role:
The successful candidate will lead advanced packaging process integration and development while remaining hands-on with laboratory work, process optimization, and technical problem-solving.
Key Responsibilities:
Lead semiconductor packaging process integration and development.Drive process development across **patterning, bonding, and CMP**.Solve complex integration challenges independently, from investigation through validation.Build and lead technical teams while maintaining hands-on process ownership.Support technology validation, manufacturing readiness, and yield improvement.Collaborate with technical partners, equipment suppliers, and research teams.
What We're Looking For:
Typically 8+ years of relevant semiconductor experience.Strong hands-on expertise in advanced packaging, process integration, and development.Direct experience with patterning, bonding technologies, and CMP.Proven technical leadership with a hands-on approach.Experience in hybrid bonding, chiplets, 2.5D/3D integration, or related technologies is an advantage.Existing U.S. work authorization is required.Ability to undertake 50%+ international travel, including potential extended stays abroad.
Education: A master's or PhD in Materials Science, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, or a related field is listed in the original job description.
Why Consider This Opportunity?
Join a founding technical team.Help develop innovative semiconductor packaging technologies.Combine strategic leadership with hands-on engineering.Receive a competitive base salary alongside equity and bonus opportunities. xzbcwsv
Interested or know someone who could be a great fit? Apply directly or send a message to learn more.
The full job description covers all associated skills, previous experience, and any qualifications that applicants are expected to have.
We are hiring Director, Process Integration & Development, an innovative technology company working at the forefront of advanced semiconductor packaging and heterogeneous integration.
This is an exciting opportunity for a senior semiconductor professional to join a founding technical team, lead critical process development initiatives, and contribute to next-generation technologies supporting AI and high-performance computing.
About the Role:
The successful candidate will lead advanced packaging process integration and development while remaining hands-on with laboratory work, process optimization, and technical problem-solving.
Key Responsibilities:
Lead semiconductor packaging process integration and development.Drive process development across **patterning, bonding, and CMP**.Solve complex integration challenges independently, from investigation through validation.Build and lead technical teams while maintaining hands-on process ownership.Support technology validation, manufacturing readiness, and yield improvement.Collaborate with technical partners, equipment suppliers, and research teams.
What We're Looking For:
Typically 8+ years of relevant semiconductor experience.Strong hands-on expertise in advanced packaging, process integration, and development.Direct experience with patterning, bonding technologies, and CMP.Proven technical leadership with a hands-on approach.Experience in hybrid bonding, chiplets, 2.5D/3D integration, or related technologies is an advantage.Existing U.S. work authorization is required.Ability to undertake 50%+ international travel, including potential extended stays abroad.
Education: A master's or PhD in Materials Science, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, or a related field is listed in the original job description.
Why Consider This Opportunity?
Join a founding technical team.Help develop innovative semiconductor packaging technologies.Combine strategic leadership with hands-on engineering.Receive a competitive base salary alongside equity and bonus opportunities. xzbcwsv
Interested or know someone who could be a great fit? Apply directly or send a message to learn more.
Details
| Company | RediRecruit RPO Solutions |
| Location | United, Pennsylvania, United States |
| Type | FULL TIME |
| Niche | hr |
| Experience | permanent |