Project Manager

Role Summary We are seeking an experienced Project Manager to lead cross-functional programs across our semiconductor design, fabrication, packaging, and test operations. The ideal candidate will drive projects from concept through high-volume manufacturing (HVM), coordinating tightly with process engineering, equipment/fab operations, supply chain, and quality teams to deliver new products, process nodes, or capacity expansions on time, within budget, and to yield/quality targets. Key Responsibilities • Own end-to-end planning and execution of semiconductor projects, including new product introduction (NPI), process transfer, yield improvement, and fab capacity/equipment installation programs. • Develop and maintain integrated project schedules, critical path analysis, and resource plans across design, wafer fab, assembly/test, and supply chain functions. • Coordinate with process, product, equipment, and reliability engineering teams to track technical milestones such as tape-out, first silicon, qualification, and ramp-to-volume. • Manage project budgets, capital expenditure (CapEx) tracking, and vendor/tooling procurement timelines in partnership with finance and procurement. • Identify, track, and mitigate risks related to yield, equipment downtime, material shortages, and schedule slippage; escalate issues with clear recovery plans. • Drive stakeholder communication through regular program reviews, status reports, and executive dashboards (e.g., using Zoho Projects, MS Project, Smartsheet, or Jira). • Partner with customers and/or foundry/vendors on program timelines, qualification requirements, and delivery commitments. • Lead post-project reviews and drive continuous improvement in project management processes, tools, and templates. Required Qualifications • Master's degree in Electrical/Electronics Engineering, Materials Science, Industrial Engineering, or related field. • 3 - 7 years of project management experience in the semiconductor, microelectronics, or related high-tech manufacturing industry. • Strong understanding of semiconductor fabrication processes (front-end and/or back-end), wafer fab operations, or IC packaging and test. • Proven track record managing multi-disciplinary teams and complex, schedule-driven programs with hard technical milestones. • Proficiency with project management tools (MS Project, Smartsheet, Jira, Primavera) and manufacturing/ERP systems (SAP, Oracle). • Working knowledge of Design of Experiments (DOE), Statistical Process Control (SPC), and yield analysis methodologies. • Excellent communication and stakeholder management skills, with experience presenting to senior leadership and customers. • PMP, PgMP, or Six Sigma certification preferred.