Hardware Design Engineer — Wearables

Orangemint Technologies Pvt Ltd · India

Interested in designing award-winning wearables while managing challenging constraints so that your products are used everyday by millions of users? Then read on..

ULTRAHUMAN • HARDWARE

Hardware Design Engineer Wearables

Bangalore (Kudlu Gate)| • On-site | Full-time |

Salary : Up to INR 20L

ABOUT THE ROLE

Ultrahuman's Hardware division builds award-winning wearables — the Ultrahuman Ring and Ring Air — pushing consumer technology in health and metabolic fitness. We're looking for a Hardware Design Engineer to own electronics design for our next-generation smart rings, from architecture and schematic capture through PCB layout, bring-up, and mass production.

This is a hands-on role at the extremes of miniaturization and power efficiency. You'll make architecture-level component decisions, drive high-density and RF layout, and take designs through NPI to volume — working closely with mechanical, firmware, and manufacturing teams on fast product cycles.

KEY RESPONSIBILITIES

Architecture & Schematic Design

• Translate product requirements into hardware architecture, then into schematics and manufacturable PCB designs using OrCAD / Allegro (Cadence).
• Own component selection across MCU/SoC, PMIC, sensor AFEs, and RF front-ends — balancing size, power, cost, and supply availability.
• Handle schematic-to-layout conversion and netlist import; create and maintain symbol/footprint libraries and land patterns.

High-Density & RF Layout

• Design and review high-density (HDI), rigid, and rigid-flex PCB layouts for space-constrained wearable form factors.
• Design 2.4 GHz BLE antennas and NFC coils, matching networks, and controlled-impedance routing; support antenna tuning and RF validation.
• Apply signal-integrity best practices for high-speed digital interfaces and mixed-signal boards.

Power & Low-Power Design

• Architect power trees around PMICs, buck/boost converters, and LDOs, including Li-ion charging for small-capacity cells.
• Build and validate ultra-low-power current budgets to meet multi-day battery-life targets.
• Strong grasp of power electronics and active/passive component behaviour.

Sensor Integration

• Integrate optical biosensing (PPG) AFEs, IMUs, temperature sensors, and haptics; own I²C/SPI interface design and analog front-end layout.

Manufacturing & DFM

• Own Gerber/ODB++ release, fabrication and assembly drawings, panelization, and full manufacturing data packages.
• Prepare and maintain BOMs; evaluate and qualify alternate / second-source components.
• Drive DFM/DFA reviews with fab and SMT/EMS partners; support NPI through EVT/DVT/PVT to mass production.
• Sound understanding of PCB materials, stackups, and component assembly processes.

Compliance, Reliability & Validation

• Apply EMI/EMC, thermal, and mechanical design best practices.
• Support pre-compliance and certification across FCC, CE, BIS, and RoHS, and familiarity with IEC standards for PCB design safety.
• Coordinate with test engineers on board bring-up and PCB validation; run circuit simulations for RF and signal/timing optimization.

Ownership & Collaboration

• Independently manage hardware projects end-to-end, including vendor coordination and delivery of final hardware.
• Collaborate with mechanical engineers to optimize designs and meet project timelines.
• Bring the latest design tools, methodologies, and industry best practices into the team.

REQUIRED QUALIFICATIONS

• Bachelor's or Master's in EEE, Electronics, or equivalent practical experience.
• 4+ years of hands-on hardware / PCB design experience, ideally in consumer electronics or wearables.
• Proficiency with a leading schematic and PCB toolchain (OrCAD / Allegro preferred).
• Proven track record taking a product from schematic through layout to volume production.
• Working knowledge of power electronics and active/passive component selection.
• Familiarity with global certifications (FCC, CE, BIS, RoHS) and IEC PCB safety standards.

PREFERRED / BONUS

• Experience with miniaturized high-density or rigid-flex designs.
• RF design experience (2.4 GHz / BLE, NFC, antenna tuning and matching).
• EMI/EMC design and pre-compliance testing experience.
• Low-power / battery-operated wearable product experience.
• Familiarity with reliability methods (DFMEA, derating) and RF / signal-timing circuit simulation.