Engineering Manager - Molding and Packaging

Company OverviewQP Technologies (formerly Quik-Pak), a division of Promex is a family-owned microelectronics assembly and product company based in Escondido, California. Founded in 1992, QP Technologies serves over 400 customers annually and is a trusted U.S. provider of on-shore, quick-turn semiconductor packaging services supporting new device and product development. Demand is growing concurrent with expansion of U.S. microelectronics, defense, and aerospace sectors and domestic reshoring prioritization.

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Position Summary:This hands-on leader owns end-to-end process development, refinement and sustainment of our high mix/volume microelectronics packaging technology.Most critically, the successful applicant will leverage their core competencies in fundamental Engineering principles to design and scale a world-class Molding operation, manage the team, and influence end-to-end microelectronics process solutions for customers in our Escondido, CA factory.
Essential Duties:Benchmark our existing Molding process and toolset by identifying root causes impacting product quality and yield at a first principles level through detailed problem solving and supporting data analysisUse design of experiments to identify and validate best consumables such as mold compound, cleaning agents, and epoxiesDevelop optimized recipes that cater to a range of products and form factors while creating a strong process with margin that caters for variations in product and materialsWork with suppliers to simulate and design optimized overmold toolingLead strategic selection and deployment of required capital equipment to scale processAdopt best known methods for process control that efficiently monitors process health over time, taking account of changeovers, preventive maintenance and event recoveryBroaden your knowledge through hands-on experience to extend to other microelectronics manufacturing processesEstablish DFM rules to ensure designs and process windows are aligned for cost, quality and throughput


Minimum Qualifications:7+ years of experience in Transfer- or Injection-molding Manufacturing Engineering in a volume environmentBachelor’s degree in Mechanical Engineering or equivalentTrack record of solving complex problemsSolid proficiency in SolidWorks for design work and revision controlSolid proficiency in statistical process control

Key Competencies:
Microelectronics/medical/aerospace domain knowledge not required — strong curiosity and willingness to learn these spaces matters moreHands-on innovator who enjoys end-to-end product ownership involving complex systemsDisciplined with excellent attention to detail and robust process controlStrong written and oral communicator
Preferred Skills:Experience with overmolding using thermoset materials (microelectronics applications are a plus), micro-molding, or accommodating complex parts comprised of mixed materialsAbility to interact with and influence key stakeholders and transfer required knowledge to manufacturing team members charged with day-to-day running of the processWillingness to use experience and knowledge to expand the role and impact beyond the core focus areaFamiliarity with working in ISO 9001 and ISO 13485 environments. xzbcwsv Understanding of AS 9100, 21 CFR Part 820, and Good Documentation Practices (GDP).