Failure Analysis Engineer

Failure Analysis (FA) Engineer - PCBA Role Overview: The Failure Analysis Engineer is responsible for performing root-cause analysis on defective or failed printed circuit board assemblies (PCBAs). By using destructive and non-destructive testing techniques—specifically Dye & Pry and Cross-Section Analysis—the engineer identifies physical defects and translates findings into actionable improvements in manufacturing and design. Key Responsibilities: Failure Analysis Execution: Perform Dye & Pry testing on suspect SMT and BGA components to verify solder joint integrity, detect fatigue cracks, pad cratering, and open circuits. Cross-Sectioning: Prepare, mount, grind, and polish PCBA samples to analyze internal layer structures, plated through-holes (PTH), intermetallic compounds (IMC), and layer thicknesses. Microscopy & Imaging: Utilize optical microscopes and Scanning Electron Microscopes (SEM) to inspect, document, and measure defects found during testing. Data Interpretation: Analyze defect data, evaluate findings against industry standards (such as IPC-TM-650 testing protocols), and document detailed FA reports. Process Improvement: Collaborate with manufacturing, quality, and process engineering teams to recommend corrective actions and prevent recurring soldering or assembly defects. Qualifications & Skills: Education: Bachelor's or Master's degree in Materials Science, Electronics, Mechanical Engineering, or a related field. Experience: Hands-on experience in PCBA lab environments, specifically handling sample preparation, mounting (puck preparation), and optical/chemical microsectioning. Industry Standards: Strong working knowledge of IPC workmanship and acceptance criteria (e.g., IPC-A-610 , IPC-TM-650 ). Analytical Tools: Experience using optical and metallurgical microscopes; familiarity with X-ray, SEM, and EDS is a strong plus.